Product Introduction
- Optimized for FPC Micro Component Grounding: High-grade Conductive Cloth Tape carrier ensures superior handling.
- Thermal Stability: Reliable performance up to 150℃ for industrial processing.
- Premium Adhesive System: Advanced Acrylic Pressure Sensitive Adhesive for balanced tack and peel.
- Processing Efficiency: Smooth unwinding and clean removal to minimize downtime.
