Essential details
G.W:0 kg
Product Introduction
- Optimized for Food Processing Baking Mold: High-grade PTFE Tape carrier ensures superior handling.
- Thermal Stability: Reliable performance up to 200℃ for industrial processing.
- Premium Adhesive System: Advanced High Temperature Silicone Adhesive for balanced tack and peel.
- Processing Efficiency: Smooth unwinding and clean removal to minimize downtime.
