ABOUR OUR COMPANY
ABOUR OUR COMPANY
COMPECB is your go-to partner for streamlining projects with our FPC (Flexible Printed Circuit) manufacturing and assembly expertise. Since 2015, we've specialized in cost-effective, high-quality solutions, offering a comprehensive range of services: FPC assembly, single & double-sided multilayer PCBs, rigid-flexible PCBs, SMT integration, and component sourcing. Our products serve diverse industries, including Telecom, Medical, Automotive, and Consumer Electronics. We prioritize reliability and excellence, adhering to strict quality control measures throughout production. Our competitive pricing, timely delivery, and exceptional customer service set us apart. We build long-lasting relationships with clients based on trust, transparency, and shared success. Choose COMPECB for your FPC needs and experience the benefits of our expertise, reliability, and dedication to customer satisfaction. Simplify your projects, enhance product performance, and drive your business forward with confidence. Trust us for reliable quality, competitive prices, timely delivery, and exceptional service that exceeds industry standards.
What can we do?
What can we do?
Various Types of FPC Manufacturing
Various Types of FPC Manufacturing
Surface Mount Technology Assembly
Surface Mount Technology Assembly
Printed Circuit Board Assembly
Printed Circuit Board Assembly
Material Procurement
Material Procurement
Printed Circuit Board Assembly
Printed Circuit Board Assembly
We specialize in high-performance FPC manufacturing, delivering cutting-edge solutions for industries demanding precision, reliability, and advanced functionality.
Our key FPC manufacturing capabilities include:
2/2mil Line Width/Spacing for Ultra-Fine Designs
Up to 20 Layers for Complex Multilayer PCBs
Blind, Buried, and Microvias for High-Density Interconnects
Thermal Management Solutions
Comprehensive Quality Testing
We specialize in high-performance FPC manufacturing, delivering cutting-edge solutions for industries demanding precision, reliability, and advanced functionality.
Our key FPC manufacturing capabilities include:
2/2mil Line Width/Spacing for Ultra-Fine Designs
Up to 20 Layers for Complex Multilayer PCBs
Blind, Buried, and Microvias for High-Density Interconnects
Thermal Management Solutions
Comprehensive Quality Testing
With rigorous quality assurance, we guarantee unmatched performance, reliability, and durability in every PCB, powering next-generation technology.
With rigorous quality assurance, we guarantee unmatched performance, reliability, and durability in every PCB, powering next-generation technology.
FPC Manufacturing Capabilities
FPC Manufacturing Capabilities
Value Propositions
Value Propositions
Precision FPC Design Solutions
Precision FPC Design Solutions
Rapid Prototyping & Small-Batch Trial Production
Rapid Prototyping & Small-Batch Trial Production
High-End Materials & Advanced Process Customization
High-End Materials & Advanced Process Customization
End-to-End Quality Management System
End-to-End Quality Management System
Lifetime Technical Consultation & After-Sales Support
Lifetime Technical Consultation & After-Sales Support
• Free DFM (Design for Manufacturability) review to proactively mitigate production risks.
• Seamless compatibility with mainstream design software formats (Altium, PADS, etc.).
• 3–5 day rapid prototyping with 24-hour expedited service available.
• Flexible small-batch production (minimum 5 units) to reduce R&D costs.
• One-stop services including SMT assembly and functional testing.
• Wide range of substrates (PI, PET, LCP) and support for advanced processes (blind vias, buried vias, selective gold plating).
• Customization of special functions like impedance control and electromagnetic shielding.
• 7×12 hour online support for prompt post-sales issue resolution.
• Free access to FPC application guides, failure analysis documents, and more.
• Regular follow-ups to assist with product iteration optimization.
• Free DFM (Design for Manufacturability) review to proactively mitigate production risks.
• Seamless compatibility with mainstream design software formats (Altium, PADS, etc.).
• 3–5 day rapid prototyping with 24-hour expedited service available.
• Flexible small-batch production (minimum 5 units) to reduce R&D costs.
• One-stop services including SMT assembly and functional testing.
• Wide range of substrates (PI, PET, LCP) and support for advanced processes (blind vias, buried vias, selective gold plating).
• Customization of special functions like impedance control and electromagnetic shielding.
• 7×12 hour online support for prompt post-sales issue resolution.
• Free access to FPC application guides, failure analysis documents, and more.
• Regular follow-ups to assist with product iteration optimization.